Description: You will get 20 syringes with 1 Gram In Each Syringe For 20 Grams Total In This Lot. You will also get the spreaders and finger cots shown in the images. Individual syringes help prevent contaminationwhich may be experienced using an open jar of heat-sink compound. Silver Cooling High Performance Thermal Grease Compound Paste Syringe. For CPU GPU VGA LED Heatsink Fan Chipset Chip Heat Spreader. Low Thermal Resistance / High Conductivity for heat transfer / High Density HY700 series Silver Thermal Grease contains Silver AGO & Silver Powder-High Cooling Performance Material To Improve Thermal Conductivity, Better than Regular Types and Good Partner For CPU / VGA Cooler Compliance with RoHS REACH PFOS requirements Thermal Conductivity: >3.17W/m-k Thermal Resistance: <0.067 C-in2/W Color: Silver Thermal Conductivity: >3.17 Thermal Impendance: <0.067 Specific Gravity: 1.35 Thixotropic Index: 350+/-10 Moment Bore Temperature: -50-280 Operation Temperature: -30-230 Ingredients: Silicone Compounds: 20% Carbon Compounds: 20% Metal Oxide Compounds: 60% Warning: This is not a Glue!! The sole purpose of this paste is to stay moist and provide additional cooling. The surface should be clean and flat so the heatsink compound can create a thin void-free layer to transfer heat from the CPU to the heatsink Warning: If this paste does not provide additional cooling, then there is a problem with either a Circuit Board due to bad capacitors or a short, or is in CPU / GPU Chip due to solder cracking and chip damage because of overheating for significant periods of time.
Price: 19.49 USD
Location: Spring, Texas
End Time: 2024-03-18T21:51:11.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Restocking Fee: No
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Compatible Brand: For Acer, For Alienware, For Apple, For ASUS, For Compaq, For Dell, For eMachines, For GIGABYTE, For HP, For IBM, For Lenovo, For LG, For MSI, For Samsung, For Sony, Universal
Thermal Resistance: <0.067 C-in2/W
Color: Silver
Metal Oxide Compounds: 60%
Silicone Compounds: 20%
Material: Silver AGO & Silver Powder-High Cooling Material
Maximum Airflow Volume: All
MPN: HY710 SILVER, 20 syringes of heat sink compound
Thermal Conductivity: >3.17W/m-k
Thixotropic Index: 350+/-10
To Fit: cpu
Carbon Compounds: 20%
Brand: HALNZIYE
Fan Diameter: All
Type: Thermal Compound
Power Connection: None
Specifications: 1 Gram In Each Syringe For 10 Grams Total
Maximum Fan Speed: All
Packaging: Syringe
Moment Bore Temperature: -50-280
Specific Gravity: 1.35
